COFAN集團：以全新3P封裝技術 破解大功率散熱難題
摘要： 近日，阿拉丁新聞中心從美國硅谷企業Cofan集團處獲悉，其近期推出的1200W的大功率工礦燈，不僅很好地解決了散熱問題，而且可使成本降至更低，現已達量產水平。另外Cofan集團在解決散熱的問題上帶來了他們獨到的3P封裝技術。記者有幸采訪到Cofan集團總裁特別助理Sang Han和集團品牌總監Carol Chiu，共同探討大功率LED燈的散熱問題和中國的市場計劃。
散熱可謂是大功率LED燈具目前最大的一道技術門檻，各廠家在散熱基板、散熱模塊的設計上也費盡了苦心,但在體積、成本和效果上仍然沒有顛覆性的突破。
Heat dissipation can be described as the biggest technical problem in high-power LED COBs at present. Many manufacturers are working hard on substrate radiation methods and radiator module design, but in terms of volume, cost, and performance they have yet to make a breakthrough.
Cofan集團美國總部大樓
近日，阿拉丁新聞中心從美國硅谷企業Cofan集團處獲悉，其近期推出的1200W的大功率工礦燈，不僅很好地解決了散熱問題，而且可使成本降至更低，現已達量產水平。他們還透露，計劃將推出2400W甚至更高功率的產品Cofan集團在解決散熱的問題上帶來了他們獨到的3P封裝技術，今天有幸采訪到Cofan集團總裁特別助理Sang Han和集團品牌總監Carol Chiu，共同探討大功率LED燈的散熱問題和他們在中國的市場計劃。
Recently, however, The Alighting News Center was glad to learn that American company Cofan Group and one of brand family- Flip Chip Opto has launched a 1200W LED COB with not only a perfect solution to the heat problem, but also lowered costs, and has now entered mass production. They also revealed that they are going to launch a 2400W COB and potentially even higher wattage products in the near future.
Cofan’s 3P unique packaging technology in solving the problem of heat dissipation, today have the opportunity to interview the Cofan Group President Special Assistant Mr. Sang Han, and the Brand Director Carol Chiu to discuss the heat dissipation of high-power LED COBs and their Chinese market plan.
Cofan集團總裁特別助理Sang Han
Cofan Group President Special Assistant-Sang Han
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